| 我司代理的韓國Mirae公司生產的MX100-MX1200系列中高速貼片機,該系列中高速貼片機有獨特的特點：X-Y軸安裝高速直線電機，便利的視窗操作界面，具有智能C喂料器的最優化機械裝置，獨特的4C設計工藝， 先進的可視系統，連續的運動控制系統，更大的PCB尺寸範圍（高達660X460mm），汽力控制系統的新概念，振動更小，中央設計更低。其中X-Y軸所使用的高速直線電機是除西門子外能成熟應用的唯一廠家 MX100-MX1200系列中高速貼片機 的主要參數： 貼裝速度:16,000CPH(0.225sec/chip)-138,000CPH(0.026sec/chip) 貼裝精度：Chip (3σ ) ± 0.050mm 元件尺寸範圍：0603~18mm square (24×18mm Rectangle)/0402mm Option 線路板尺寸( L X W X T )：Single Conv.：50x50x0.4t ~ 410x360x5.0 [mm] Item | Mx100 | Mx100P | Mx200 | Mx200P | Optimal Condition | Chip(1005) | 16,000CPH (0.225sec/chip) | 9,200CPH (0.391sec/chip) | 23,000CPH (0.157sec/chip) | 17,000CPH (0.212sec/chip) | IPC 9850 Standard CPH | Chip (1005) | 14,000CPH (0.257sec/chip) | 8,000CPH (0.450sec/chip) | 21,000CPH (0.171sec/chip) | 15,000CPH (0.240sec/chip) | QFP (208) | - | 2,400CPH | - | 1,200CPH | Placement Accuracy | Chip (3σ) | ±0.050mm | QFP (3σ) | N/A | ±0.025mm | N/A | ±0.025mm | FOV24 Area camera | Single FOV | 0603~18mm square (24×18mm Rectangle)/0402mm Option | Component Types | Chips, Can Caps, Small ICs | FOV36 Area camera | Single FOV | N/A | ~32mm square (42×32mm Rectangle) | N/A | ~32mm square (42×32mm Rectangle) | Multiple FOV | N/A | ~50mm square (90×30mm Rectangle) | N/A | ~50mm square (90×30mm Rectangle) | Component Types | N/A | QFP, BGA, Connectors | N/A | QFP, BGA, Connectors | Minimum Lead Pitch | FOV24 camera | 0.30mm | FOV36 camera | N/A | 0.38mm | N/A | 0.38mm | Board Size | Minimum(L×W×T) | 50×50×0.4mm | Single Place(L×W×T) | 410×460×5.0mm/680×460×5.0mm(Option) | Dual Place(L×W×T) | N/A | Weight(max.) | 2.0kg | Board Transfer | Transport Features | Manual Board Width Adjustment | Number of Heads | 4 Module | 2 Precision | 6 Module | 4Module, 1 Precision | Maximum Number of Tape Feeders (8mm) | 80EA(40×2) | Feeder | Reel Types | 8(2P,4P), 12,16,24,32,44,56,72,88mm | Tray Feeder | N/A | TF5(20 Tray Feeder Unit) MS1(60×2 Multi-tray Supplier) | MS1(60×2 Multi-tray Supplier) | TF5(20Tray Feeder Unit) MS1((60×2 Multi-tray Supplier) | Other Types | Vibration Stick Feeder, Manual Tray | Power Requirements | 3 phase 200/208/220/230/240/380/400/415/430[v] 50/60Hz | Power Consumption | Approx.3KVA | Air Pressure | 0.54Mps | Air Consumption | Approx.130NI/min | Approx.90NI/min | Approx.180NI/min | Approx.160NI/min | Weight | Approx. 1,200Kg | Dimensions(W×D×H), Cover Only [mm] | 1,200×1,900×1,500mm | | | | | | | | | | | | | |
Item | Mx400 | Mx400P | Mx800 | Mx800P | Mx1200 | Optimal Condition | Chip(1005) | 46,000CPH (0.078sec/chip) | 40,000CPH (0.090sec/chip) | 92,000CPH (0.039sec/chip) | 71,000CPH (0.051sec/chip) | 138,000CPH (0.026sec/chip) | IPC 9850 Standard CPH | Chip (1005) | 42,000CPH (0.086sec/chip) | 31,000CPH (0.116sec/chip) | 80,000CPH (0.045sec/chip) | 62,000CPH (0.058sec/chip) | 120,000CPH (0.030sec/chip) | QFP (208) | - | 3,500CPH | - | 7,000CPH | - | Placement Accuracy | Chip (3σ) | ±0.050mm | QFP (3σ) | N/A | ±0.025mm | N/A | ±0.025mm | N/A | FOV24 Area camera | Single FOV | 0603~18mm square (24×18mm Rectangle)/0402mm Option | Component Types | Chips, Can Caps, Small ICs | FOV36 Area camera | Single FOV | N/A | ~32mm square (42×32mm Rectangle) | N/A | ~32mm square (42×32mm Rectangle) | N/A | Multiple FOV | N/A | ~50mm square (90×30mm Rectangle) | N/A | ~50mm square (90×30mm Rectangle) | N/A | Component Types | N/A | QFP, BGA, Connectors | N/A | QFP, BGA, Connectors | N/A | Minimum Lead Pitch | FOV24 camera | 0.30mm | FOV36 camera | N/A | 0.38mm | N/A | 0.38mm | N/A | Board Size | Minimum(L×W×T) | 50×50×0.4mm | Single Place(L×W×T) | 410×460×5.0mm/680×460×5.0mm(Option) | |
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